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February 8, 2004...In his talk last week at Strategies In Light, Bob Walker raised more
than a few eyebrows with detailed information on the dramatic buildup of HB-LED
production in Asia, outside Japan. His talk, titled High Brightness LED Producers
in Taiwan, Korea and China showed that 2003 production totals of epi-based
HB LED companies in Taiwan, Korea and China produced and sold 8.9 billion InGaAlP
chips and 3.0 billion GaN chips. He also detailed epiwafer output. When compared
to what these three countries collectively produced in 2002, this ramp represents
a 25% increase in InGaAlP, representing 80% of the world's output. In GaN production,
their work took a 700% increase over 2002 and represented 40% of the world's
total output. Bob pointed out to the +300 people in attendance that the region
is active in various innovative programs such as high-end InGaAlP chips, low-cost
InGaAlP chips and high power GaN/white chips, plus innovative approaches to
wafer bonding and the use of alternative substrates, as well as leveraging their
long-standing knowledge of flip chip packaging, and use of new contacts and
phosphors. He revealed details of Taiwan's active Solid State Lighting Initiative
and said that Korea has identified SSL as a key industry, and that China is
planning a major initiative under their latest 5 Year Plan. Full details will
be included in the study Bob has co-authored for Strategies Unlimited, titled
Asian Producers
of High-Brightness LEDs (Taiwan, South Korea, China) which is already
on sale. Intel, Toshiba, Motorola Join +30 Others in Mobile Standards AllianceFebruary 8, 2004...The task of setting standards for mobile devices is now in full swing through
the Mobile Industry Processor Interface (MIPI)
Alliance with the latest companies joining to be Intel, Motorola, and Toshiba,
bringing the number of firms in MIPI from the original 4 to well over 30. MIPI
was organized specifically to establish global standards for key semiconductor
technologies for mobile devices. The group was founded last summer by Texas
Instruments Inc., STMicroelectronics N.V., ARM Ltd. and Nokia Corp. to enable
users of a wide variety of mobile devices to use common online services and
software. Until now, companies such as Motorola and Intel had stayed out of
the group because it aims to turn technology based on TI's OMAP application
processor, which is used in Nokia's devices, into the global standard. “Our
growing membership base sends a clear signal that the mobile industry supports
the objectives of our organization,” said Tom Vial, Chairman of the Board,
MIPI Alliance, Inc. “The diversity of the companies involved leaves little
doubt that the MIPI Alliance is an open organization, and the specifications
we produce will be widely adopted.” More details are included in the MIPI
release RFMD Sees Continued Rise of Handset Market and More ConsolidationFebruary 8, 2004...At a recent presentation to the annual Thomas Weisel Partners Conference in
San Francisco, RF Micro Devices of Greensboro, North Carolina USA reported that
they expect their sales in the handset market in 2004 to increase in excess
of the rate of growth of the overall handset market, and in doing so, that they
will continue to increase their dollar content, per handset manufactured. "Our
dollar content per handset manufactured has increased by approximately 40 percent
since 2001," said Dean Priddy, CFO of RFMD. "That will continue
as we bring more functionality into power amplifiers and take share in cellular
transceivers, which is a market that is ready for consolidation." Dollar
content per handset manufactured is calculated by dividing RFMD's annual handset
sales by the total number of handsets manufactured each year. Priddy further
commented on RFMD's power amp market share: "We're in one out of every two
phones manufactured, and we intend to gain market share in current- and next-generation
PAs this calendar year. We are absolutely the leader in next-generation air
interface standards, and there is no company with higher market share in GPRS,
EDGE or WCDMA than RF Micro Devices." More details are available via the
replay
of the presentation and in the company
news release.
II-VI and SET Sign Joint Distribution Agreement for GaN on SiC SubstratesFebruary 8, 2004...II-VI Inc. of Saxonburg, Pennsylvania USA and Sensor Electronic Technology
Inc. (SET) of Columbia, South Carolina USA have entered into a joint marketing
and sales agreement for III-Nitride based epitaxial wafers produced by SET on
Silicon Carbide substrates manufactured by II-VI. The two companies will jointly
market their products in the United States, Japan, and Germany using II-VI's
marketing and distribution infrastructure. The initial product portfolio includes
quaternary AlInGaN-based 2" and 3" diameter epitaxial wafers on 6H-SiC substrates
and also 2", 3" and 4" diameter epitaxial wafers on sapphire substrates. "This
distributorship agreement with a large materials manufacturer such as II-VI
gives our company an opportunity to reach out to overseas markets through a
well-established marketing and sales infrastructure in a very cost efficient
way", says Dr. Remis Gaska, President and CEO of SET. "It is an integral
part of our strategy to become a leading source of III-Nitride based epitaxial
wafer technology on silicon carbide substrates." Company
news release Emcore Sees Pickup in Broadband and Digital FiberFebruary 8, 2004...Emcore Corporation of Somerset, New Jersey USA enjoyed a revenue increase of
146% from their newly focused specialties now that the company is able to concentrate
solely on the epi, device, and module business for broadband and wireless communications.
Revenues reached record levels of $23.1 million in Q-1 and they expect to see
second quarter revenues somewhere between $24-26 million. "We are seeing
continued signs of improvement in the fiber and broadband communications market
and feel our performance during the quarter is an indication markets are rebounding,”
commented Reuben F. Richards, Jr., President & CEO. “The quarter came in
better than anticipated on both a revenue and gross profit basis. We are seeing
strong revenue growth in many of our product lines, especially broadband and
digital fiber, as a result of significant new product introductions with broad
customer acceptance." He added that the company will continue to focus
on " continuing to improve gross margins by improving yields and supply
chain management, as well as other operating efficiencies.” The company
reported on Feb. 5th and a replay of their conference call to analysts will
be available on the Emcore website until
Feb. 12. Company
news release Osram Opto Lights the Way to New Automotive AppsFebruary 8, 2004...Inside the next gen autos and outside as well, Osram Opto's latest application
rollouts for the automotive industry are impressive. In conjunction with the
North American International Auto Show in Detroit, Osram unveiled two applications.
The one application falls into the "designer interior" category, allowing
a driver to choose any one of 127 colors for the instrument backlighting on
the new 300 horsepower Ford Mustang. The selection of colors is made possible
by controlling specific combinations of red, blue and green LEDs, and at the
push of a button, drivers can adjust the color to suit their own personal preferences
and color perception, thanks to Osram's 6leadMultiLEDs. In addition to
Ford's Mustang, the new offering is also on the Ford GT and the Shelby Cobra.
Details are in the company
news release (English) and we've also posted a German
version. Upfront and outside, Osram Opto also showed their latest white
LED headlights on Hyundai’s HCD8 concept car. “The 'Hyundai HCD8' concept
vehicle provides the perfect showcase for OSRAM Opto Semiconductors as one of
the few companies that can provide a full SMT product portfolio,” said Tom
Shottes, Vice President of North American LED Products. Osram HB-LEDs also appeared
as tail lights and brake lights. Company
news release (English) and German
version LRC Launches Online Seminar SeriesFebruary 8, 2004...The Lighting Research Center (LRC) at Rensselaer Polytechnic Institute (RPI)
in Troy, New York USA has launched a new online educational seminar series targeted
to help architects, engineers, facility managers, building owners, developers,
energy service professionals, and other professionals needing a better understanding
of light and lighting. Cleverly calling it Live! from the LRC, the online
series will bring lighting experts via the Internet to participants’ desktops
to provide the latest information on important lighting topics. All that is
needed to participate in these seminars is an Internet-connected computer and
a telephone. All participants will receive two university continuing education
units (CEUs) for each seminar attended. Dates and topics slated, and details
of how to access the information (the seminars are priced at $100 each) are
included in the LRC
news release. LayTec's ExpandingFebruary 8, 2004...LayTec of Berlin, Germany reported an extremely successful year for their in-situ
sensor business, especially for the GaN production sensor they've dubbed EpiTT.
As a result, the company is now rebuilding their offices at Helmholtzstrasse
in Berlin, which will mean more office space for new employees, a bigger laboratory
for testing new devices and an increased production area to meet the deadlines
for the constantly growing amount of new orders. They're planning to employ
4 new staff members (a manager of production and logistics, a key-account manager,
a customer support person and a student assistant). In further news from LayTec,
which is included in their monthly newsletter,
the company noted that EpiTT has established itself as an advanced sensor
for applications in MOCVD mass production of GaN and GaAs-based LEDs, and that
they've now installed it in their MBE system, a Riber 49, at Nanosemiconductor
NSC GmbH in Dortmund, Germany. The company is using their Riber, with EpiTT,
to produce quantum dot epiwafers. Dr. Kovsh (Chief Technology Officer at NSC)
and Dr. Krestnikov (Product Manager) will apply the EpiTT for an improved
wafer temperature control during the growth of long-wavelength (1.3 to 1.5 micron)
QD lasers based on GaAs. The formation of QDs is known to be very sensitive
to substrate temperature changes, and the precise control LayTec's sensors provide
helps control film thickness for a very accurate DBR tuning, deemed indispensable
to VCSEL applications at NSC. Our news features are reported
by the CompoundSemi News staff writers.
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