June 2, 2008... Family of Innovative Power Amplifiers Tailored to Select Qualcomm Chipsets
Woburn, Massachusetts USA--Skyworks Solutions,
Inc., an innovator of high performance analog and mixed
signal semiconductors enabling mobile connectivity, today announced
several new front-end solutions supporting Qualcomm's newest code
division multiple access (CDMA) and HSDPA enhanced data for GSM
evolution (HEDGE) reference platforms:
-- The SKY77166 - a 450 megahertz (MHz) power amplifier (PA) for
CDMA handsets and wireless local loop (WLL) applications in a
4 x 4 mm package - the smallest in the industry for
applications in this frequency range. Skyworks is also working
on defining a next-generation product that would drastically
improve talk times in this growing market and will be designed
to support certain Qualcomm chipsets.
-- The SKY77183 (3 x 3 mm PA for the cellular band) and the
SKY77184 (3 x 6 mm dual-band PA for cellular and PCS bands
with integrated coupler) - Skyworks' first PAs with full
bypass mode. Routing the input signal directly from input to
output bypasses the PA at low powers, enabling optimal
operation at low output power levels and eliminating the need
to supply current to the amplifier stages, resulting in
significant savings in average battery current.
-- The SKY77336 PAM - designed in a compact 5 x 5 mm form factor
for quad-band cellular handsets for GSM, GPRS and EDGE.
At a higher level, this is the first time Skyworks is working
directly with Qualcomm on handset platforms targeted for
next-generation multimode handset manufacturers.
"We are delighted to be working with Qualcomm on several exciting
and upcoming handset platforms, particularly given their innovative
radio architectures and technology leadership position," said David J.
Aldrich, president and chief executive officer of Skyworks. "When
combined with our core front-end capabilities, together we plan to
deliver feature rich, best-in-class solutions to a number of the
world's leading handset OEMs and smartphone suppliers."
The chipsets will support multiple wireless platform customers.
The companies will manufacture these solutions, with mobile devices
incorporating these designs available as early as later this year.
About HSDPA
High-speed downlink packet access (HSDPA) is a third generation
(3G) mobile telephony communications protocol in the high-speed packet
access (HSPA) family, which allows networks based on universal mobile
telecommunications system (UMTS) to have higher data transfer speeds
and capacity. Current HSDPA deployments support downlink speeds of
1.8, 3.6, 7.2 and 14.4 megabits (Mbit), with further speed increases
planned in the near future.
About Skyworks
Skyworks Solutions, Inc. is an innovator of high performance
analog and mixed signal semiconductors enabling mobile connectivity.
The company's power amplifiers, front-end modules and direct
conversion radios are at the heart of many of today's leading-edge
multimedia handsets. Leveraging core technologies, Skyworks also
offers a diverse portfolio of linear products that support automotive,
broadband, cellular infrastructure, industrial and medical
applications.
Headquartered in Woburn, Mass., Skyworks is worldwide with
engineering, manufacturing, sales and service facilities throughout
Asia, Europe and North America. For more information, please visit
Skyworks' Web site at: www.skyworksinc.com.
Safe Harbor Statement
This news release includes "forward-looking statements" intended
to qualify for the safe harbor from liability established by the
Private Securities Litigation Reform Act of 1995. These
forward-looking statements include information relating to future
results and expectations of Skyworks (including certain projections
and business trends). Forward-looking statements can often be
identified by words such as "anticipates," "expects," "intends,"
"believes," "plans," "may," "will," "continue," similar expressions,
and variations or negatives of these words. All such statements are
subject to certain risks and uncertainties that could cause actual
results to differ materially and adversely from those projected, and
may affect our future operating results, financial position and cash
flows.
These risks and uncertainties include, but are not limited to:
global economic and market conditions, such as the cyclical nature of
the semiconductor industry and the markets addressed by our, and our
customers', products; our ability to develop, manufacture and market
innovative products in a highly price competitive and rapidly changing
technological environment; fluctuations in our manufacturing yields
due to our complex and specialized manufacturing processes; our
reliance on several key customers for a large percentage of our sales;
fluctuations in the manufacturing yields of our third party
semiconductor foundries and other problems or delays in the
fabrication, assembly, testing or delivery of our products; the
availability and pricing of third party semiconductor foundry,
assembly and test capacity and raw materials; our ability to timely
and accurately predict market requirements and evolving industry
standards, and to identify opportunities in new markets; losses or
curtailments of purchases or payments from key customers, or the
timing of customer inventory adjustments; our ability to rapidly
develop new products and avoid product obsolescence; our ability to
retain, recruit and hire key executives, technical personnel and other
employees in the positions and numbers, with the experience and
capabilities, and at the compensation levels needed to implement our
business and product plans; lengthy product development cycles that
impact the timing of new product introductions; the timing,
rescheduling or cancellation of significant customer orders and our
ability, as well as the ability of our customers, to manage inventory;
unfavorable changes in product mix; the quality of our products and
any remediation costs; shorter than expected product life cycles;
problems or delays that we may face in shifting our products to
smaller geometry process technologies and in achieving higher levels
of design integration; economic, social and political conditions in
the countries in which we, our customers or our suppliers operate,
including security and health risks, possible disruptions in
transportation networks and fluctuations in foreign currency exchange
rates; our ability to continue to grow and maintain an intellectual
property portfolio and obtain needed licenses from third parties; and
the uncertainties of litigation, including disputes over intellectual
property, as well as other risks and uncertainties, including but not
limited to those detailed from time to time in our filings with the
Securities and Exchange Commission.
These forward-looking statements are made only as of the date
hereof, and we undertake no obligation to update or revise the
forward-looking statements, whether as a result of new information,
future events or otherwise.
Note to Editors: Skyworks and Skyworks Solutions are trademarks or
registered trademarks of Skyworks Solutions, Inc. or its subsidiaries
in the United States and in other countries. Qualcomm is a registered
trademark of Qualcomm Incorporated. CDMA2000 is a registered trademark
of the Telecommunications Industry Association (TIA USA). All other
brands and names listed are trademarks of their respective companies.
CONTACT: Skyworks Solutions, Inc.
Media Relations:
Amanda Ingalls, 949-231-3045
or
Investor Relations:
Thomas Schiller, 949-231-4700