NTT Photonics Laboratories Select CCS reactor for InP Devices
Source/Type: Press Releases - As issued by company

September 26, 2007... Aachen, Germany--AIXTRON AG today announced the order of one Close Coupled Showerhead® (CCS) 3x3" Flip Top MOCVD system received from NTT Photonics Laboratories, Japan in the second quarter of 2007. This new system will be used for the development of indium phosphide (InP) based optical and microelectronic devices. The reactor will be installed at the company's state-of-the-art cleanrooms of NTT Photonics Laboratories.

Dr. Hiroaki Takeuchi, Executive Manager of the Advanced Opto-electronics Laboratory at NTT Photonics Laboratories comments: "We are very familiar with the AIXTRON MOCVD systems and the quality of service. We have been very pleased with our previous CCS system which was for GaN electronic device development. The AIXTRON group reactors have unequalled capabilities for the type of R&D we are presently engaged in. The Close Coupled Showerhead® tools have earned a strong reputation in Japan and elsewhere and we are confident that the equipment is an excellent match to our requirements. Superior to other vertical systems thanks to its process stability and precursor efficiency it will give us the process flexibility, good uniformity in thickness, doping, and composition we need for developing nextgeneration optical and microelectronic devices."

For further information on AIXTRON AG please consult our website at: www.aixtron.com.

Forward-Looking Statements

This news release may contain forward-looking statements about the business, financial condition, results of operations and earnings outlook of AIXTRON within the meaning of the "safe harbor" provisions of the United States Private Securities Litigation Reform Act of 1995. Words such as "may", "will", "expect", "anticipate", "contemplate", "intend", "plan", "believe", "continue" and "estimate", and variations of these words and similar expressions, identify these forward-looking statements. The forward-looking statements reflect our current views and assumptions and are subject to risks and uncertainties. You should not place undue reliance on the forward-looking statements. The following factors, and others which are discussed in AIXTRON's public filings and submissions with the U.S. Securities and Exchange Commission, are among those that may cause actual and future results and trends to differ materially from our forward-looking statements: actual customer orders received by AIXTRON; the extent to which chemical vapor deposition, or CVD, technology is demanded by the market place; the timing of final acceptance of products by customers; the financial climate and accessibility of financing; general conditions in the thin film equipment market and in the macro-economy; cancellations, rescheduling or delays in product shipments; manufacturing capacity constraints; lengthy sales and qualification cycles; difficulties in the production process; changes in semiconductor industry growth; increased competition; exchange rate fluctuations; availability of government funding; variability and availability of interest rates; delays in developing and commercializing new products; general economic conditions being less favorable than expected; and other factors. The forward-looking statements contained in this news release are made as of the date hereof and AIXTRON does not assume any obligation to update or revise any forward-looking statements, whether as a result of new information, future events or otherwise, unless required by law.

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