Materials (GaN, GaAs, etc.), Epi & Equipment channel!
CompoundSemi Online serves
the information needs of the compound semiconductor industry and its supply
chain with product and market news updates for this rapidly evolving technology.
Our "all the news on one page" format, with select channels for specific
interests, offer the most efficient news delivery approach in the industry.
If you're looking for LED
or Solid State Lighting News...
You're darn right they're part
of the compounds, but we're also proud to say that the LED segment has "graduated"
and can benefit from publications that are more dedicated to those topics. For
news on the broad LED industry, outside of general lighting, along with the
materials and technology supply chain, visit LIGHTimes
Online. For a higher level view of LEDs in general lighting, you can visit
Solid State Lighting Design,
which covers packaged "lighting quality" LEDs through subsystems,
luminaires and application stories.
Trifortune Purchases Aixtron System for GaN LEDs on Substrates other than Sapphire
LIGHTimes News Staff
April 22, 2014...Trifortune Electronic Technology Co. Ltd. of Jintan City, China, has
reportedly ordered Aixtron’s AIX G5 HT system to develop gallium nitride
based high brightness LEDs. Trifortune wants the AIX G5 HT system configured
for 56×2-inch wafers per run. Aixtron’s team will install the system at
Trifortune’s R&D center in the Jiangsu area. The company plans to
transfer the developed process to mass production after successfully completing
Dr. Hu, Technical Head of Trifortune, commented, “We are
developing GaN processes to grow LEDs on substrates that offer some advantages
compared to the well-established sapphire substrates. To compete in the HB-LED
market, there is a real need to achieve the maximum yield in our manufacturing
process, so that products with better performance in lumen per dollar can be
Osram Selects Altatech’s Inspection and Metrology System
April 15, 2014...Altatech, a subsidiary of Soitec, of Montbonnot, France, reported that Osram Opto Semiconductors ordered its Orion LedMax wafer inspection and metrology system. Altatech says that Osram will use the tool to improve the yield, performance, and cost efficiency of its LED-processing. The Orion LedMax inspection system is for both R&D and volume manufacturing applications. Osram will use the system to perform production control and new product qualification of its epitaxial wafers used in fabricating LEDs
The Orion system can inspect wafers from four inches to eight inches in diameter and combines the capabilities of 2D inspection, defect height measurement and dark-field inspection in one platform. According to Altatech, this solution outperforms more expensive systems by generating more information than only diffracted light signature. The system reportedly identifies potentially critical defects amid noisy backgrounds and delivers superior matching performance, while reducing system maintenance costs. Orion can perform incoming wafer qualification, process development, and line monitoring. Proprietary Orion modules can detect, count and classify defects on patterned and unpatterned wafers for front side and back side surface inspection, edge inspection, bump and through-silicon-via (TSV) metrology.
“After a very extensive evaluation of available options, Osram’s selection of our Orion system confirms both the performance and the cost efficiency of our solution,” said Jean-Luc Delcarri, general manager of Soitec’s Altatech subsidiary. “The integrated functions of our holistic inspection systems are unique and unmatched in any other suppliers’ production tools.”
Yole Development Predicts New Wave of MOCVD Equipment Purchases with Big-Three Dominance Continuing
LIGHTimes News Staff
April 10, 2014...Yole Development forecasts a new wave of investment in MOCVD equipment for
LED fabrication in 2014 through 2016. The market for LEDs for general lighting
will drive this wave of investment, according to Yole. Unlike the overly
optimistic run of MOCVD investment in the business in 2010 to 2011, based upon
expectations of the LCD display market, improvement in equipment throughput and
yields as well as increased competition and industry consolidation will limit
the impact of the latest investment cycle.
Three companies will continue to monopolize the market. Aixtron, Veeco, and
Tayo Nippon Sanso had about 97 percent market share among them in 2013. Yole
predicts that the equipment market will peak at about $580 million in 2015 with
MOCVD reactors representing more than 80 percent of the total. Yole indicated
that Chinese and Taiwanese manufacturers are purchasing the bulk of these MOCVD
reactors as they switch to 4" systems.
Yole notes that LED epitaxy requires dedicated tools supplied by companies
that have much knowledge about fabricating LEDs. According to Yole, more than
20 entrants (mostly from Asia) into the MOCVD reactor business since 2010 have
attained little success. Their total market contribution rose from 2 percent in
2010 to just 3 percent in 2013.
Yole cites two reasons for these company's unsuccessful entrance into the
market. First, the new entrants have missed the first two LED growth cycles
(small display and large display applications) that have allowed the main three
to build expertise and their networks (sales offices, training centers, etc.).
Even big names, such as Applied Materials, was not able to access these
markets. Secondly, revenue from the 2010 to 2011 investment cycle, which
included a total of more than $2 billion for MOCVD reactors, have allowed
Aixtron and Veeco to slash prices and start a price war with which others can
Decreasing the cost of ownership is the main strategy that new entrants into
the MOCVD market are adopting, Yole says. MOCVD Equipment makers can reduce the
cost of ownership with innovations such as a new heating system, new gas flow
design, and increased automation. Yole does not expect new entrants to have a
substantial increase in future market share as the expertise and capital of
Aixtron and Veeco (the Big Two) far surpass their competitors.
In the short term, Yole anticipates only two types of MOCVD equipment
suppliers (outside of the Big three) will survive. These are suppliers that
collaborate with some big LED manufacturers and Chinese suppliers that can
scrape together pieces of the huge local market.
Sapphire Market to Diversify as LEDs Move to Silicon, IHS Predicts
LIGHTimes News Staff
March 18, 2014...In November 2013, IHS Inc. predicted a 40 percent penetration of gallium
nitride-on-silicon (GaN-on-Si) into the GaN LED market by 2020. Notably, only a
few companies currently manufacture silicon-based LEDs. However, IHS forecasts
that these few companies and others entering the market are likely to ramp
production capacity over 2014, at a lower price than conventional LED chips.
IHS predicts that this lower price point will result in a shift towards silicon
The company says that since 2011, many sapphire ingot producers have entered
the LED market, and have steadily expanded production capacity. IHS points to
rumors in the industry that many of the major suppliers have no room for for
capacity growth, and some smaller companies want to exit the market.
IHS says that the shift to silicon wafers and increased competition is
likely to force sapphire ingot and wafer suppliers to make some hard decisions
to remain in business. One option is to diversify into other markets such as a
protection covers for consumer electronic devices (i.e. smartphones, digital
camera and tablets).
Sapphire has a higher dielectric constant and better medium-wave infrared
transparency than glass and is also the second hardest material after diamond.
In September 2013, Apple Inc. filed a patent with the U.S. Patent and Trademark
Office (USPTO) that revealed the company's intention to add sapphire laminate
to future devices. This could give the new iPhone 6, 4th generation iPad, and
iWatch a stronger, scratch resistant. The home button fingerprint sensor of the
iPhone 5s already uses sapphire crystal. IHS contends that other smartphone and
tablet manufacturers are likely to follow suit.
NRL Scientists Make Computational Models of LED "Droop" Effect and Suggest Method to Combat It
LIGHTimes News Staff
February 20, 2014...Scientists at NRL's Center for Computational Materials Science, in
collaboration with researchers at the Technion, Israel, and Ioffe
Physical-Technical Institute, Russia, have created computational models showing
that the observed droop effect arises from non-radiative Auger recombination of
the injected carriers. The rate of the Auger recombination is proportional to
the cube of the carrier concentration. As a result, the noradiative Auger decay
rate grows rapidly with current density, quenching the generation of light.
The scientists suggested a method that could significantly increase the
efficiency of green-blue-ultraviolet light-emitting diodes based on GaInN/GaN,
AlGaN/GaN, and AlInN/GaN quantum wells. They published this research in the
January 25 and November 26,
2013 issues of Applied Physics Letters.
In order to suppress these non-radiative Auger processes that cause the
dreaded "droop" in efficiency as drive current increases, the scientists
suggest that one needs to create quantum wells with a soft confinement
potential. Dr. Alexander Efros, a senior researcher in NRL's Materials Science
and Technology Division, previously showed theoretically that a softened
electrostatic potential prevents carriers from acquiring the momentum necessary
for nonradiative Auger processes, and thus suppresses the Auger decay rate
which causes "droop". This concept was patented by NRL in March 2013. In their
latest calculations, the NRL-Technion-Ioffe research team demonstrated that
softening the confinement potential through the varying the alloy composition
along the growth direction can completely suppresses the piezoelectric field
that normally enhances nonradiative Auger processes in GaN/AlN QWs, thus the
droop effect in such quantum wells can be significantly or even completely
Rubicon Technology to Showcase Large-Diameter Patterned Sapphire Substrates (PSS) at LED Korea 2014
LIGHTimes News Staff
February 13, 2014...Rubicon Technology, Inc. of Bensenville, Illinois USA, a provider of
sapphire substrates and products to the LED market, announced that it
will showcase large-diameter patterned sapphire substrates (PSS) as well as its
line of 6”polished sapphire wafers for the LED industry at LED Korea 2014
at COEX, Seoul, Korea, February 12-14, 2014. Rubicon will exhibit its line of
sapphire products in Booth #4707.
The company notes that most high-brightness LED manufacturers etch a pattern
into the sapphire wafers in order to both improve epitaxial growth and extract
more light from each chip. Rubicon says that its patterned sapphire substrates
have been available for purchase in smaller diameters from other companies, but
claims that it is the first company to offer 6” and 8” patterned
sapphire substrates. Rubicon points out that it offers 4", 6", and 8" patterned
sapphire substrates for LED chip manufacturers.
“Rubicon Technology continues to pioneer innovations in sapphire
substrates,” said Raja M. Parvez, president and CEO, Rubicon
Technology. “As the world’s most experienced provider of 6-inch
sapphire wafers, Rubicon is uniquely positioned to drive the evolution of
substrates – patterning large diameter sapphire substrates. This advance
helps LED manufacturers gain the efficiency of larger diameters, combined with
the industry’s most precise patterning capability, all from a supplier
known for quality and reliability at high volume.”
Rubicon offers fully customizable sub-micron patterning capability with
dimensional tolerances, within ±0.1 µm. The company reportedly maximizes usable
area with an edge exclusion zone as small as 1 mm. Patterning comes in a range
of shapes including: cone, dome and pyramid, and in a variety of
Arima Optoelectronics Launches LED Di on Molybdenum Substrates
LIGHTimes News Staff
February 11, 2014...Arima Optoelectronics during the second half of 2013, launched red and yellow LED di on silicon substrates. The company leveraged its "laser cutting on silicon substrate" patents. The company has now launched LED di on Molybdenum (MO) substrates.Noteably, MO substrates have better heat conductivity than silicon or GaAs. The company says its new epitaxial technology and mask design allow the di on MO substrates to withstand higher application drive current. The new Molybdenum substrate LED di in the 14 mil chip size, exhibits a stable performance under 150mA driving current. These new generation MO substrated LED dice are now available in 14, 20 and 42 mils. (1 mil=.0254 mm).
Micro Modular Updates AT100 Test Machine for Production of COB LEDs
LIGHTimes News Staff
February 4, 2014...The AT100 test machine is Micro Modular's core production line for COB LEDs.
According to the company, the AT100 system allows a fully automated,
in-production optical & electrical test program for each LED on a substrate
or for singulated LEDs. Its modular design combines the optical test hardware
with process modules, like a camera-based dim test for die evenness, a laser
marking for unit ID and more. The system's design reportedly allows easy and
economical customization of the machine and production line for different
process steps and production requirements.
Micro Modular's AT100 offers a wide variety of possible sphere diameters.
The units on the substrate can be tested separately with the option of a
temperature controlled test fixture. The system has a new fixture design that
shields the substrates from environmental influences during the test. A special
coating on the substrate fixture further increases the accuracy of the test
While the AT100 was fully designed around the conveyor, the newly designed
transfer stations allow parallel testing of more LED units and larger substrate
sizes. The station is said to be easily adjustable to different substrates for
product changes. These transfer stations significantly increase the positioning
accuracy for denser substrates and ultimately leads to a large increase in UPH
in substrates per hour. The company also optimized the tester software UI for
the automated production run, with updates on user management, result reporting
and programming of test flows.
The input and output options include magazines or conveyor for substrates,
as well as tubes and trays for units singulated before test. MMS also offers as
complement the singulation and sorting machine AB330, in a modular design with
further marking and inspection options and the MOL42 degas & curing
You could own this space...
For information on our plans and to reserve promotion space contact
Send us an email
or call +1 (512) 257-9888